Ruggedized Products Deployed in Harsh Environments

NAI is a leader in designing advanced embedded board and system-level products for the most demanding air, land, and sea requirements, and our products are deployed in a wide range of harsh military, aerospace and industrial environments. We utilize best-in-class design, manufacturing, and test methodologies to develop products that achieve the highest levels of efficiency, power and performance that can operate effectively in harsh, rugged environments; sustain extreme temperature changes; and withstand vibration, shock, and corrosive conditions. Our design tools include thermal and structural analysis and advanced simulation software. Rugged environmental standards include MIL-STD-810 & VITA 47.

In house environmental and EMI ruggedization qualification capabilities include temperature, vibration (sine & random), shock, humidity, and conducted emissions. As required, NAI supplements these capabilities through the use of local test laboratories. Our systems are ruggedized and tested to ensure they operate in harsh environments. Tests include altitude, temperature-altitude, contaminate protection, explosive atmosphere, MIL-STD-461 EMI testing, and lightening testing. 

Unless otherwise specified, the following table outlines the general Environmental Specifications design guidelines for board level products of North Atlantic Industries. All of our cPCI, VME and OpenVPX boards are designed for either air or conduction cooling. All boards also incorporate appropriate stiffening to ensure performance during shock and vibration and also to assure reliable operation (lower fatigue stresses) over the service life of the product.


1 / Commercial-AC (Air Cooled) 2 / Rugged-AC (Air Cooled) 3 / Rugged-CC (Conduction Cooled)
Temperature - Operating 0º C to +70º C, Ambient H -40º C to +85º C, Ambient I -40º C to +85º C, at wedgelock thermal interace
Temperature - Storage -40º C to 85º C -55º C to 105º C -55º C to 105º C
Humidity - Operating 0 to 95%, non-condensing 0 to 95%, non-condensing 0 to 95%, non-condensing
Humidity - Storage 0 to 95%, non-condensing 0 to 95%, non-condensing 0 to 95%, non-condensing
Vibration - Sine A 2 g peak, 15 Hz - 2 kHz B 6 g peak, 15 Hz - 2 kHz B 10 g peak, 15 Hz - 2 kHz C
Vibration - Random D 0.002 g2/Hz, 15 Hz - 2kHz 0.04 g2/Hz, 15 Hz - 2 kHz 0.1 g2/Hz, 15 Hz - 2kHz E
Shock F 20 g peak, half-sine, 11 ms 30 g peak, half-sine, 11 ms 40 g peak, half-sine, 11 ms
Low Pressure G Up to 15,000 ft. Up to 50,000 ft. Up to 50,000 ft.

Specifications subject to change without notice.


  1. Based on a sweep duration of ten minutes per axis, each of the three mutually perpendicular axes.

  2. Displacement limited to 0.10 D.A. from 15 to 44 Hz.

  3. Displacement limited to 0.436 D.A. from 15 to 21 Hz.

  4. 60 minutes per axis each of the three mutually perpendicular axes.

  5. Per MIL-STD-810G, Method 5.14.6 Procedure I, Fig. 514.6C-6 Category 7 tailored (11.65 Grms): 15 Hz - 2 kHz;
    PSD increasing @ 4 dB/octave from 0.4 g2/Hz to 0.1 g2/Hz between 150 Hz - 300 Hz, 0.1 g2/Hz between 300 Hz
    - 1000 Hz and decreasing @ 6 dB/octave from 0.1 g2/Hz to 0.025 g2/Hz between 1000 Hz - 2000 Hz.

  6. Three hits per direction per axis (total of 18 hits).

  7. For altitudes higher than 50,000 ft. contact NAI.

  8. High temperature operation requires 350 lfm minimum air flow across cover/heatsink (module dependent).

  9. High temperature operation requires 600 lfm minimum air flow across cover/heatsink (module dependent).